The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) group today announces the release of the OSFP 4.0 Specification for 800G OSFP modules. While the OSFP module was designed from the beginning to support 800G performance, the OSFP 4.0 specification adds support for dual 400G and octal 100G breakout modules with dual LC, dual Mini-LC, dual MPO and octal SN/MDC fiber connector options. "At 800G, the number of use cases involving aggregation or breakouts are increasing," said Andreas Bechtolsheim, OSFP MSA Chair. "Being able to use existing standard fiber connectors for these breakout ports is a key issue since it avoids the optical performance impact and cost of fiber adaptor cables, splitter cables or patch panels."
The Octal Small Form Factor Pluggable (OSFP) Multi Source Agreement (MSA) Group has released the electrical and mechanical specifications for the new OSFP form factor. A total of 80 companies have joined the OSFP MSA to create this new standard. Established in November 2016, the OSFP MSA group has developed a high-performance pluggable optics module form factor that is capable of supporting the full range of 400G optics technologies for datacenter and metro applications. In addition, the OSFP is designed to support the next generation of 800G optics modules that will use eight lanes of 100Gbps, and offers backwards compatibility with 100G QSFP via a simple adaptor.
Arista Networks, together with Acacia Communications, Accelink, Adva Optical Networking, Amphenol, AppliedMicro, Applied Optoelectronics, Barefoot Networks, Broadcom, Cavium, ClariPhy Communications, ColorChip, Coriant, Corning, Dell EMC, Finisar, Foxconn Interconnect Technology, Fujitsu Optical Components, Google, Hewlett Packard Enterprise, Hitachi Cable Systems, Huawei Technologies, Infinera, Innolight, Innovium, Inphi, Intel, Ixia, Juniper Networks, Kaiam, Lorom, Lumentum, Luxtera, Macom, Marvell, Mellanox Technologies, Molex, MultiLane, NeoPhotonics, NEL America, Nokia, Oclaro, PHY-SI, SAE, Senko, Source Photonics, Sumitomo Electric Industries, TE Connectivity, and Yamaichi Electronics announced the formation of the OSFP (Octal Small Form-factor Pluggable) Multi-Source Agreement.