A: The OSFP is a pluggable form factor with 8x high speed electrical lanes that support up to 400 Gbps (8x50G), 800 Gbps (8x100G), or 1.6 Tbps (8x200G). Up to 36 OSFP ports are supported in 1 U front panel.
A: The standard OSFP form factor has an integrated heatsink for improved thermal performance. The heatsink can be either open top or closed top. Meanwhile, OSFP-RHS provides same electrical performance but does not have integrated heatsink. As such, a separate cooling solution in the form of a riding heatsink (RHS) is required and allows for greater versatility. Refer to the OSFP specification for the further details.
A: The OSFP-XD is a pluggable form factor with 16x high speed electrical lanes, doubling the faceplate density versus OSFP. Hence, it supports up to 800 Gbps (16x50G), 1.6 Tbps (16x100G), or 3.2 Tbps (8x200G). The OSFP-XD specification is a separate document.
A: No, due to mechanical and electrical differences, OSFP modules are not compatible with OSFP-XD ports, and vice-versa. Mechanical keying features on the modules prevents insertion into the wrong port type.
A: The OSFP MSA defines the OSFP and OSFP-XD specifications, including the mechanical module, the card cage, the electrical interface and pinout.